Solutions for the Future
In response to the need for a new approach to materials processing, TAMPL was established at Tufts University College of Engineering in 1989. The laboratory has taken a unique two-tiered approach to solving and preventing thermal problems in materials science and manufacturing.
Projects undertaken by TAMPL (1) typically involve unexplored issues in thermal-fluid and materials science and (2) have a potential impact on industrial practices. Tufts is an acknowledged leader in the emerging field of thermal manufacturing.
Companies with thermally related problems may collaborate with TAMPL in a variety of ways. Contracted and consultant work can be developed for investigations lasting several weeks or up to several years. Projects are reviewed regularly by the company and TAMPL investigators.
Sample projects include: Thin-film processing, Microelectronics packaging, Thermal relaxation in multilayer structures, Polymer film adhesion, Zone melting recrystallization, Rapid thermal processing, Scan welding, Thermal rapid prototyping, Chemical mechanical polishing, and Biomedical engineering .
Activities in TAMPL have been or are currently funded by: Apple Computer, Cabot Corporation , Digital Equipment Corporation, Galileo Electro-Optics, Intel Corporation, Kopin Corporation, Link Foundation, Lufkin Foundation, McDonnell-Douglas Corporation, Millipore, National Science Foundation, Office of Naval Research, Perkin-Elmer Corporation, Raytheon Company, U.S. Department of Defense, and U.S. Environmental Protection Agency.
Results of nonproprietary research have appeared in a broad range of journals that reflect the work's interdisciplinary nature. Examples include the Journal of Applied Physics, Journal of Materials Research, Journal of Multiphase Flow, International Journal of Heat and Mass Transfer, Thin Solid Films, Glass Technology, Optical Engineering, Materials Letters, and Physics of Fluids.
Mechanical Engineering Department @ School of Engineering @ Tufts University (Medford, MA)